Develops and Manufactures Bonding Equipment, Die Bonders, Wire Bonders, Test Equipment and Fully Integrated Assembly Lines
Keywords: F&K Delvotec, F & K, Delvotec, semiconductor equipment, wire bond, die bond, ball bond, ultrasonic bonding, wire bonding, used bonder, wire bonder, die bonding, die bonder, wedge bonding, wedge bonder, eutectic, flip chip, flip chip bonding, chip on board, COB, mapping, wafer mapping